LR-M/F series vertical furnace series
Classification:
- DESCRIPTION
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- Commodity name: LR-M/F series vertical furnace series
- Commodity ID: LR-M/F series vertical furnace s
Product application scope: suitable for the semiconductor and a few SMT industries; Important parameters: Curing temperature: ≤ 200 ℃ Cooling temperature: ≤ 50 ℃.
Technical Features & Product Advantages:
1. This equipment is a vertical heating solid furnace developed for semiconductors, SMT, dispensing and glue potting, which turns the plane heating space into a three-dimensional heating space, which has the advantages of saving energy consumption and space.
2. The perfect alternative to tunnel heating furnace, the efficiency of this equipment is equivalent to that of 20-35 meters tunnel furnace.
3. The equipment adopts an embedded system, which is different from ordinary touch screen and industrial computer. Not only stable and reliable. The communication interface is more abundant and convenient.
4. The equipment adopts a real dual-temperature zone design, which can not only realize dual-temperature zone heating, but also heat one temperature zone and one temperature zone cooling.
5. The equipment transportation chain is driven by servo motor. The program has the function of compensating for the high temperature thermal expansion and contraction of the chain, which can effectively prevent the lifting chain from being stuck due to the accumulated error caused by thermal expansion and cold contraction.
6. The equipment supports the formula function of key welding parameters and supports MES remote data reading.
7. This equipment adopts a unique level + up and down wind. Different from the traditional air transport module, it can effectively prevent most of the products from causing the air transport to be not in place.
8. The equipment heating system adopts 3-level protection, which effectively prevents the product from being damaged by over-temperature.
9. The equipment has a 10,000-level dust-free design, which can be applied to any dust-free place.
10. Intelligent PID fuzzy operation is used for equipment heating, which has stronger thermal compensation ability and lower energy consumption.
Technical Parameters:
Device model LR/F-300 LR/F-400 LR/F-600 Equipment size (mm) L1800xW1550xH2200 L2000xW1550xH2200 L2200xW1550xH2200 Machine weight APPROX:1500KG APPROX:1600KG APPROX:1800KG Fixture size(mm) L300*D250*H25 L400*D350*H25 L600*D500*H25 Number of heating zones 4 temperature zones (2 up, 2 down) 4 temperature zones (2 up, 2 down) 4 temperature zones (2 up, 2 down) Exhaust requirements 5m³/H 5m³/H 5m³/H Power requirements 3P 380V/220/480 50/60Hz 3P 380V/220/480 50/60Hz 3P 380V/220/480 50/60Hz Total power 25KW 30KW 35KW Power consumption 5KW 6KW 7KW Hot air speed regulation Frequency conversion speed regulation Frequency conversion speed regulation Frequency conversion speed regulation Heating time APPROX:15-30min APPROX:15-30min APPROX:15-30min Curing temperature ≤200℃ ≤200℃ ≤200℃ Temperature control method PID closed-loop control + high-frequency pulse PID closed-loop control + high-frequency pulse PID closed-loop control + high-frequency pulse Temperature control accuracy ±1.0℃ ±1.0℃ ±1.0℃ Heating zone temperature difference ±2.0℃ ±2.0℃ ±2.0℃ Furnace surface temperature ≤50℃ ≤50℃ ≤50℃ Parameter storage A variety of production settings can be saved A variety of production settings can be saved A variety of production settings can be saved Single-layer chain bearing capacity 5KG 5KG 5KG The bearing capacity of the whole machine 250KG 250KG 250KG Direction of transport Standard left to right Standard left to right Standard left to right Fixture edge support ≥5mm ≥5mm ≥5mm Signal interface Front confidential board/rear machine out board Front confidential board/rear machine out board Front confidential board/rear machine out board Transport motors Servo/stepper motor Servo/stepper motor Servo/stepper motor Push plate motor Stepper motor Stepper motor Stepper motor Inlet/Outlet Height(mm) 900±20 900±20 900±20 Productivity 60min/baking time (min) × number of layers of the board 60min/baking time (min) × number of layers of the board 60min/baking time (min) × number of layers of the board Preservation level 25mm(64） 50mm(32) 75 mm(16) Baking time 8min-10000min can be set 8min-10000min can be set 8min-10000min can be set Note: This technical parameter is for reference only, and the actual parameter is set by the technical specifications and production process provided by the manufacturer.
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