LR series semiconductor vacuum reflow soldering
- DESCRIPTION
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- Commodity name: LR series semiconductor vacuum reflow soldering
- Commodity ID: LR series semiconductor vacuum r
Product application scope: high-power devices (diodes, transistors, MOS transistors), IGBT, fast charging, and power management chips.
Technical Features & Product Advantages
1. This equipment is an imported platform, carefully built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor welding vacuum welding equipment, products for SOP, SOT, DIP, QFN, BGA, IGBT TO, MINILED and other vacuum chip packaging and welding.
2. This equipment adopts industrial control embedded control system, and the system adopts dual CPU operation, which can run independently from the computer (computer crash).
3. It is not only stable and reliable, but also has more accurate temperature control.
4. Provide replaceable heating modules for customer products to effectively solve the phenomenon of tin frying caused by temperature difference.
5. Exclusive patented Flux solder paste automatic recovery system to reduce equipment maintenance and cleaning.
6. The equipment supports the formula function of key welding parameters and supports MES remote data reading.
7. Intelligent ammonia monitoring and control system not only saves protective gas, but also lowers oxygen content.
8. Step vacuuming design, up to 5 steps can be vacuumed.
9. The patented water-cooled structure of the sealing ring not only has a longer life and lower cost, but also reduces the expensive product damage caused by poor sealing.
10. The maximum vacuum can reach 0.1KPa, Void Single <0.5%, Total <1%.
11. The fastest cycle time is 25s/per cycle, and the vacuum reflow soldering industry has the highest efficiency.
12. The warm-up time is about 30min.
13. Perfectly match ASM and domestic DB equipment.
Technical Parameters:
Device model LR-1013VNL LR-1012VNL LR-1012VN LR-812VN Equipment size (mm) L2800xD1450xH1818 L2800xD1450xD1818 L2200xD1450xH1818 L2200xD1450xH1818 Machine weight APPROX:1550KG APPROX:1500KG APPROX:1400KG APPROX:1400KG Number of top heating zones 3 pcs 3 pcs 3 pcs 3 pcs Top heating method thermal radiation thermal radiation thermal radiation thermal radiation Bottom heating 10 pcs 10 pcs 10 pcs 8 pcs Bottom heating method contact contact contact contact Number of cooling zones 2 pcs 2 pcs 2 pcs 2 pcs Number of vacuum zones 1 pc 1 pc 1 pc 1 pc Hotplate length 340mm 340mm 340mm 340mm Hotplate width 120mm 130mm 90mm 120mm Product thickness 0.2-5mm 0.2-5mm 0.2-5mm 0.2-5mm Productivity ≤120PCS/H ≤120PCS/H ≤120PCS/H ≤120PCS/H Maximum temperature 420℃ 420℃ 420℃ 420℃ Minimum oxygen level 50ppm 50ppm 50ppm 50ppm Heating plate temperature difference ≤±3℃ ≤±3℃ ≤±3℃ ≤±3℃ Power requirements 3P 380V 50/60Hz 3P 380V 50/60Hz 3P 380V 50/60Hz 3P 380V 50/60Hz Total power 35kw 35kw 32kw 28kw Power consumption ≤8kw ≤8kw ≤7kw ≤5kw Compressed gas pressure ≥5kg/cm² ≥5kg/cm² ≥5kg/cm² ≥5kg/cm² Shielding gas pressure 2.5kg/cm² 2.5kg/cm² 2.5kg/cm² 2.5kg/cm² Cooling water flow 10-25L/min 10-25L/min 10-25L/min 8-20L/min Nitrogen consumption APPROX:150-200L/min APPROX:150-200L/min APPROX:150-200L/min APPROX:150-200L/min Voiding rate APPROX:1%-2% APPROX:1%-2% APPROX:1%-2% APPROX:1%-2% Note: This technical parameter is for reference only, and the actual parameter is set by the technical specifications and production process provided by the manufacturer.
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