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LR series semiconductor vacuum reflow soldering


Product application scope: high-power devices (diodes, transistors, MOS transistors), IGBTs, fast charging and power management chips, aerospace and research institutes, some mobile phone PCBA boards, medical industry, military industry, high-speed rail industry, signal communication industry, drone industry, etc.
  • DESCRIPTION
    • Commodity name: LR series semiconductor vacuum reflow soldering
    • Commodity ID: LR series semiconductor vacuum

    Product application scope: high-power devices (diodes, transistors, MOS transistors), IGBTs, fast charging and power management chips, aerospace and research institutes, some mobile phone PCBA boards, medical industry, military industry, high-speed rail industry, signal communication industry, drone industry, etc.

    Technical Features & Product Advantages

    1. This equipment is produced by an imported platform, vacuum reflow soldering with independent intellectual property rights, and the products are aimed at high-power modules such as semiconductor power devices and IGBTs, which require high-temperature soldering.

    2. This equipment adopts industrial control embedded control system, and the system adopts dual CPU operation, which can run independently from the computer (computer crash). Not only is it stable and reliable, but the temperature control is more precise.

    3. This equipment adopts the design of ultra-high temperature use environment, which can meet the welding needs of ultra-high temperature products.

    4. The equipment supports the formula function of key welding parameters and supports MES remote data reading.

    5. Step-by-step vacuum design, up to 5 steps can be evacuated.

    6. The patented water-cooled structure of the sealing ring not only has a longer life and lower cost, but also reduces the expensive product damage caused by poor sealing.

    7. The maximum straight airness can reach 0.1KPa, Void Single<1%, Total <2%.

    8. The fastest cycle time is 30s/per cycle, and the vacuum reflow soldering industry has the highest efficiency.

    9. The warm-up time is about 30min.

    10. The furnace cavity adopts microcirculation air transportation, and the internal temperature difference in the temperature zone is smaller.

     

    Technical Parameters:

    Device model LR-612D LR-613D
    Equipment size (mm) L6300xD1450xH1560 L6300xD1450xH1560
    Machine weight APPROX:3000KG APPROX:3100KG
    Number of heating zones 6 up, 6 down 6 up, 6 down
    Number of cooling zones 2 up, 2 down, 4 cooling zones 3 up, 3 down, 6 cooling zones
    Cooling method Forced cold Forced cold
    Exhaust requirements 10m³/Hx2 10m³/Hx2
    Voiding rate APPROX:1%-2% APPROX:1%-2%
    Control system
    Power requirements 3P 380V 50/60Hz 3P 380V 50/60Hz
    Total power 60KW 64KW
    Segmented starting power 35KW 35KW
    Power consumption APPROX:12KW-18KW APPROX:13KW-18KW
    Hot air blower speed regulation Frequency conversion stepless speed regulation Frequency conversion stepless speed regulation
    Heating time APPROX:30min APPROX:30min
    Temperature control range Room temperature ~400°C can be set Room temperature ~400°C can be set
    Production recipes Multi-combination recipes can be stored Multi-combination recipes can be stored
    Transportation
    Orbital logarithms Monorail Monorail
    Track structure 3-stage combined structure 3-stage combined structure
    Vehicle size (mm) L330xD250 L330xD250
    Conveyor belt height(mm) 900±20 900±20
    Shipping method Isometric push plates Isometric push plates
    Vacuum system
    Minimum vacuum pressure 0.1Kpa 0.1Kpa
    Vacuum pump flow APPROX:1000L/min APPROX:1000L/min
    Pressure relief time ≤10s ≤10s
    Productivity ≥40s ≥40s
    Optional nitrogen system
    Nitrogen structure Full/local nitrogen filling Full/local nitrogen filling
    Nitrogen system Automatic or manual switchable Automatic or manual switchable
    Nitrogen consumption APPROX:300-500L/min APPROX:300-500L/min

    Note: This technical parameter is for reference only, and the actual parameter is set by the technical specifications and production process provided by the manufacturer.

     

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