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Phosphorus containing epoxy resin LN-0103


Solvent free&low viscosity&high P% phosphorus containing epoxy resin The LN-0103 series is a solvent-free, low viscosity, high phosphorus content phosphorus containing liquid epoxy resin. Similar to general epoxy resins, it is suitable for various types of epoxy resin curing agents, accelerators, fillers (carbonates are not recommended), auxiliary materials, and curing reactions at various temperatures to manufacture various types of halogen-free flame retardant epoxy resin products.
  • DESCRIPTION
    • Commodity name: Phosphorus containing epoxy resin LN-0103

    Solvent free&low viscosity&high P% phosphorus containing epoxy resin The LN-0103 series is a solvent-free, low viscosity, high phosphorus content phosphorus containing liquid epoxy resin. Similar to general epoxy resins, it is suitable for various types of epoxy resin curing agents, accelerators, fillers (carbonates are not recommended), auxiliary materials, and curing reactions at various temperatures to manufacture various types of halogen-free flame retardant epoxy resin products.

    Product Overview

    1. Amine curing: aliphatic amines, alicyclic amines, polyamides, aromatic amines, dicyandiamides are cured at room temperature or by heating.

    2. Composite materials, copper clad laminates, insulating boards: dicyandiamide, BPS, phenolic resin curing: it is recommended to choose products with high phosphorus content, and make various high-performance and high-efficiency flame retardant products after modification.

    3. Anhydride curing: make various electronic and electrical halogen-free flame retardant epoxy resin products.

    Reference ratio: (please determine on the basis of experiment)

    Active hydrogen curing agent (amine, acid, phenolic hydroxyl): epoxy/curing agent = 1.00/1.00 (EQ).

    dicyandiamide (5 active hydrogen, theoretical equivalent=16.8 (g/eq) curing agent: epoxy/active hydrogen = 1.00/0.5~0.65 (eq), the curing temperature can be appropriately reduced when the curing temperature exceeds 170 °C, and the amount of dicyandiamide can be appropriately increased when the curing temperature is relatively low.

    Anhydride curing: epoxy resin containing epoxy group per 1 equivalent group (g), the ratio of methyl 4 or methyl 6: 155~170 (g).

    Analyze the project unit

     LN-0103

    remark
    appearance Congratulations Burnt transparent ~ light yellow liquid pith  
    viscosity cpslat25c ≤20000 P% is different
    chroma G 3≤  
    Escort shares wt% 0.2≤ Bake at 150°C for 60min
    Oxygen constant geq 230~280 P% is different
    Phosphorus content w1t% 4.0~6.5 p% is different
    Hydrolysis of chlorine ppm ≤300  
    wrap KG/BARREL 25 ± 0.5 Packed in plastic or metal drums
    Shelf life month 6 Store unopened indoors

     

    Areas of application

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